Microstructured Endoscopic components.
Characteristics:
Our high-definition micropatterned endoscopic components are made using the very versatile UV-LiGA process with photoresist features defining an inverted shape of the final part-geometry. These microparts need to have vertical sidewalls in order to function mechanically.
1: Fully-populated wafer with 500µm deep cavities, ready for electroforming.
2: Fully-populated wafer with 500µm deep cavities, ready for electroforming.
3: Mold for Microclamp-devices on a wafer, ready for electroforming.
4: Collection of different micro-components.
5: Collection of different micro-components.
Material: Nickel-Phos12 (580HV), stainless, optional PVD-coatings
Applications: Robust micromechanical parts for endoscopic use.
Specifications:
- Pattern size ≥ 5µm
- Part thickness = 20 - 500µm
- Material: Nickel-Phos12 (580HV), stainless
- Aspect ratio = 5 - 6 (depends on pattern-design)
- EXCLUSIVE: Adjustable pattern-tapering up to ‹ 15°
- Manufacturing according to adapted LiGA-process
- Multilevel pattern available
- Alignment-precision: level-to-level ≤ 3μm
- Maximal patterned area = 200 x 200mm
- Parallelism Frontside-to-backside ≤ 10μm
- Available PVD-coatings (e.g. noble metals, wear-resistant coat.)
- Compatible photoresist for UV-lithography:
AZ positive resists, Microchem SU-8
Click here to open printer-ready version
1. Convert customer data into Maskdesign
2. Fabrication of maskset
3. Lithography on substrates =» resist-mold
4. Prepare the resist-master for Ni-electroforming
5. Lapping excessive Nickel to final thickness and surface finishing (polishing)
6. Removal of resist
7. Optional coating with noble metal or wear-resistant coating