Master with a thickness range 0.5 - 3mm are being used on hot-embossing machines. Preferably called “stamp " The stamp is being screwed tightly to either heated base plate. An excellent physical contact between hotplate and stamp is vital to ensure proper thermal coupling.
1. Convert customer data into Maskdesign
2. Fabrication of maskset
3. Lithography on substrates =» resist-master
4. Prepare the master for Ni-electroforming =» Nickel-master (pattern inverted / mirrored)
5. Removal of wafer and resist
6. Mechanical post-processing the geometry of the stamp for mounting on the hot-embossing machine.
1. Prepare the customer-substrate for Ni-electroforming =» Nickel-master
2. Removal of wafer and resist
3. Mechanical post-processing of the stamp geometry for mounting on the hot-embossing machine.
- Pattern depth range = 70nm - 500μm
- Pattern height uniformity = 3 – 5%
- EXCLUSIVE: Adjustable drafted sidewalls up to 15° (easy demolding)
- Manufacturing according to adapted LiGA-process
- Multilevel pattern available (micro+nano)
- Alignment-precision: level-to-level ≤ 3μm
- Alignment-precision: micropattern to machined features ≤ 20μm
- Stamp thickness = 0.5 - 3mm
- Maximal stamp dimensions = 300 x 300mm
- Maximal patterned area = 200 x 200mm
- Parallelism Frontside-to-backside ≤ 20μm (Backside: surface grinded)
- Robust handling
- Integration of mechanical mounting features
- Ready-to-use stamps according to customer drawing
- Contour wire-electrodischarge machined (tolerance = ± 10µm)
- Available antisticking-coating (fluoro-based)
- Available wear-protection coating (TiN)
- Compatibility to most patterning methods: - e-beam resists (PMMA, HSQ)
- UV-lithography: AZ positive resists, Microchem SU-8
- Hot-embossed polymers, Thermal imprinting,...